Completeness and dimension inspection of printed circuit boards (PCBs)

Our concepts are equipped with an AI-powered target/actual comparison system that enables precise defect detection in various formats such as .BMP, .TIFF, and others. The systems offer adjustable LED intensity and wavelength, allowing flexible adaptation to different materials. Another advantage is the adjustable camera tilt angle, which ensures precise alignment and thus optimal defect detection.

For seamless integration into existing production processes, all models feature digital outputs for PLCs and robots. In addition, they offer an OPC-UA interface, enabling simple and standardized communication with other systems. To ensure perfect integration into your production environment, the machine frames of the models are custom-made.

Models L, M, and S are standard concepts that can serve at any time as the basis for an agile development process to create customized solutions tailored to your specific requirements. This flexibility allows the systems to be adapted to the individual needs of your production environment.

Model L:

• Measurement width: 640 mm

• Pixel accuracy: 40 micrometers

• Repeatability: 30 micrometers at 3 sigma

Model M:

• Measurement width: 320 mm

• Pixel accuracy: 20 micrometers

• Repeatability: 15 micrometers at 3 sigma

Model S:

• Measurement width: 160 mm

• Pixel accuracy: 10 micrometers

• Repeatability: 6.6 micrometers at 3 sigma